Hindustan Times | A road map to propel US-India chips push

Prime Minister (PM) Narendra Modi will travel to Washington DC on June 21 for his first official State visit. A prominent item on the agenda is technology cooperation. In May last year, the two governments elevated their strategic partnership by announcing an initiative on Critical and Emerging Technology (iCET). During this visit, the two sides will aim to announce concrete steps under this initiative. This article proposes a way forward on one of the main pillars of iCET: Resilient semiconductor supply chains. iCET’s readout explicitly mentioned enhanced cooperation in three areas: Supporting the development of a semiconductor design, manufacturing, and fabrication ecosystem in India; promoting the development of a skilled semiconductor workforce; and encouraging the development of fabs for mature technology nodes and packaging in India. Using iCET’s vision, we propose cooperation options in the three archetypal stages of the semiconductor supply chain: Design, manufacturing, and Outsourced Assembly and Test (OSAT).